TEKWARM
CHIP-UFH BOARD
Moisture resistant routed chipboard, available in standard, foiled, or bonded to additional thermal or acoustic insulation.
KEY FEATURES
✓ Structural floor system specially designed for the installation of underfloor heating system pipes
✓ Chipboard panels are tounge and grooved for faster installation
✓ Can be supplied with thermal or acoustic insulation bonded to the under side, enhancing performance.
For more information, please contact us on:
LOW FLOOR BUILD UP
Chip-UFH Board is installed
directly on to joists allowing
for a lower floor build up.
FOIL FACED OPTION AVAILABLE
For extra thermal
performace, Chip-UFH
Board can be supplied with
a foil face.
OPTIMUM ROOM TEMPERATURES
Quickly and efficiently
transfers heat from
the underfloor heating
pipes.